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Electro Mechanical Assembly Technician

Fremont, CA 94538

Employment Type: Contract to Hire Category: Technician Job Number: 10799 Pay Rate: $30/hr. - $35/hr.

Job Description

Qualifications:
  • AA or equivalent experience as an E/M Technician.  7+ years in electro-mechanical assembly, specifically within the semiconductor, solar, disk drive industries.
  • Proven ability to wire electrical panels according to NFPA 79 or UL 508A standards.
  • Expertise in crimping various connector types (D-sub, Circular, Ferrule, etc.).
  • High proficiency in reading electrical schematics and identifying symbols for sensors, motors, and controllers.
  • Ability to read and interpret mechanical assembly drawings.
  • Familiarity with precision measurement tools (calipers, micrometers, multi-meters, and oscilloscopes).
  • Familiar with hand tools and power tools
  • Education: High School Diploma required; AA degree in Mechanical/Electrical Technology or related technical certification is highly preferred.

Responsibilities:
  • Electrical Panel Fabrication: Layout and build electrical control panels from scratch, including mounting components (PLCs, VFDs, breakers, and power supplies) and performing neat, point-to-point wiring.
  • Cable Management: Expertly run cables and wire harnesses through complex mechanical frames, ensuring proper routing, strain relief, and EMI/EMC separation.
  • Precision Termination: Perform high-quality crimping, soldering, and labeling of connectors and terminals to ensure long-term system reliability.
  • Schematic Interpretation: Read and interpret complex electrical schematics, mechanical CAD drawings, blueprints, and pneumatic/fluidic diagrams to guide the assembly process.
  • System Start-up: Perform initial machine "bring-up," including voltage checks, I/O checkout, and software/control system verification.
  • Troubleshooting: Diagnose and resolve electrical, mechanical, and pneumatic issues during the build and testing phases.
  • Calibration: Perform precision alignments and calibrations of subsystems to meet sub-micron accuracy requirements.


 

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