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Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Mechanical Engineering, or related technical field
• 7+ years of experience in technical product management for high-performance handheld devices.
• Experience with mobile ODM ecosystems, custom chassis tooling, and advanced thermal solutions
• Knowledge of SOC architecture, memory topologies, and firmware power states (PL1/PL2)
• Strong understanding of advanced cooling technologies such as vapor chambers, heat pipes, and micro-pumps
• Knowledge of high-bandwidth unified memory architectures and thermal architecture integration
• Experience with thermal system design, calibration, and validation
• Familiarity with industry regulatory standards and quality control processes
• Bilingual in English and Mandarin is a must

Responsibilities

• Drive engineering development of bespoke high-capacity internal thermal systems capable of rejecting large heat loads without external docks.
• Manage the integration of high-bandwidth unified memory architectures to achieve extensive context windows for AI models.
• Ensure the system maintains maximum clock speeds and thermal stability during sustained high-wattage loads.
• Collaborate with cross-functional teams to optimize thermal, mechanical, and firmware integration for consistent performance.
• Enforce quality standards and have the authority to veto sign-offs if thermal or clock performance issues arise during development.

Keywords
mobile thermal management, high-performance computing, AI workstation, thermal architecture, vapor chambers, heat pipes, micro-pumps, high bandwidth memory, unified memory, SOC architecture, firmware power states, system integration, thermal validation, acoustic performance, thermal throttling, heat rejection, portable AI solutions, ODM ecosystems, high wattage systems, temperature control